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? 2007 microchip technology inc. preliminary ds22021b-page 1 25aa512/25lc512 device selection table features: ? 20 mhz max. clock speed ? byte and page-level write operations - 128-byte page -5 ms max. - no page or sector erase required ? low-power cmos technology - max. write current: 5 ma at 5.5v, 20 mhz - read current: 10 ma at 5.5v, 20 mhz - standby current: 1 a at 2.5v (deep power- down) ? electronic signature for device id ? self-timed erase and write cycles - page erase (5 ms, typical) - sector erase (10 ms/sector, typical) - bulk erase (10 ms, typical) ? sector write protection (16k byte/sector) - protect none, 1/4, 1/2 or all of array ? built-in write protection - power-on/off data protection circuitry - write enable latch - write-protect pin ? high reliability - endurance: 1 million erase/write cycles ? temperature ranges supported; ? pb-free and rohs compliant pin function table description: the microchip technology inc. 25aa512/25lc512 (25xx512 * ) is a 512 kbit serial eeprom memory with byte-level and page-level serial eeprom functions. it also features page, sector and chip erase functions typically associated with flash-based products. these functions are not required for byte or page write opera- tions. the memory is accessed via a simple serial peripheral interface (spi) compatible serial bus. the bus signals required are a clock input (sck) plus sepa- rate data in (si) and data out (so) lines. access to the device is controlled by a chip select (cs ) input. communication to the device can be paused via the hold pin (hold ). while the device is paused, transi- tions on its inputs will be ignored, with the exception of chip select, allowing the host to service higher priority interrupts. the 25xx512 is available in standard packages includ- ing 8-lead pdip, soic, and advanced 8-lead dfn package. all packages are pb-free and rohs compliant. package types (not to scale) part number v cc range page size temp. ranges packages 25lc512 2.5-5.5v 128 byte i,e p, sn, sm, mf 25aa512 1.8-5.5v 128 byte i p, sn, sm, mf - industrial (i): -40 cto +85 c - automotive (e): -40c to +125c name function cs chip select input so serial data output wp write-protect v ss ground si serial data input sck serial clock input hold hold input v cc supply voltage 25lc512 cs so wp v ss 1 2 3 4 8 7 6 5 v cc hold sck si pdip/soic/soij (p, sn, sm) dfn cs so wp v ss hold sck si 25lc512 5 6 7 8 4 3 2 1 v cc (mf) 512 kbit spi bus serial eeprom *25xx512 is used in this doc ument as a generic part number for the 25aa512, 25lc512 devices.
25aa512/25lc512 ds22021b-page 2 preliminary ? 2007 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings (?) v cc ............................................................................................................................... ..............................................6.5v all inputs and outputs w.r.t. v ss ......................................................................................................... -0.6v to v cc +1.0v storage temperature ............................................................................................................ .....................-65c to 150c ambient temperature under bias ................................................................................................. ..............-40c to 125c esd protection on all pins ..................................................................................................... .....................................4 kv table 1-1: dc characteristics ? notice : stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for an extended period of time may affect device reliability. dc characteristics industrial (i): t a = 0c to +85c v cc = 1.8v to 5.5v industrial (i): t a = -40c to +85c v cc = 2.0v to 5.5v automotive (e): t a = -40c to +125c v cc = 2.5v to 5.5v param. no. sym. characteristic min. max. units test conditions d001 v ih 1 high-level input voltage .7 v cc v cc +1 v d002 v il 1 low-level input voltage -0.3 0.3 v cc vv cc 2.7v d003 v il 2 -0.3 0.2 v cc vv cc < 2.7v d004 v ol low-level output voltage ?0.4vi ol = 2.1 ma d005 v ol ?0.2vi ol = 1.0 ma, v cc < 2.5v d006 v oh high-level output voltage v cc -0.5 ? v i oh = -400 a d007 i li input leakage current ? 1 acs = v cc , v in = v ss to v cc d008 i lo output leakage current ?1 acs = v cc , v out = v ss to v cc d009 c int internal capacitance (all inputs and outputs) ?7pft a = 25c, clk = 1.0 mhz, v cc = 5.0v (note) d010 i cc read operating current ? ? 10 5 ma ma v cc = 5.5v; f clk = 20.0 mhz; so = open v cc = 2.5v; f clk = 10.0 mhz; so = open d011 i cc write ? ? 7 5 ma ma v cc = 5.5v v cc = 2.5v d012 i ccs standby current ? ? 20 10 a a cs = v cc = 5.5v, inputs tied to v cc or v ss , 125c cs = v cc = 5.5v, inputs tied to v cc or v ss , 85c d13 i ccspd deep power-down current ?2 1 a a cs = v cc = 2.5v, inputs tied to v cc or v ss , 125c cs = v cc = 2.5v, inputs tied to v cc or v ss , 85c note: this parameter is periodically sampled and not 100% tested.
? 2007 microchip technology inc. preliminary ds22021b-page 3 25aa512/25lc512 table 1-2: ac characteristics ac characteristics industrial (i): t a = 0c to +85c v cc = 1.8v to 5.5v industrial (i): t a = -40c to +85c v cc = 2.0v to 5.5v automotive (e): t a = -40c to +125c v cc = 2.5v to 5.5v param. no. sym. characteristic min. max. units conditions 1f clk clock frequency ? ? ? 20 10 2 mhz mhz mhz 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 2t css cs setup time 25 50 250 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 3t csh cs hold time 50 100 500 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 ( note 3) 4t csd cs disable time 50 ? ns 5 tsu data setup time 5 10 50 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 6t hd data hold time 10 20 100 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 7t r clk rise time ? 20 ns (note 1) 8t f clk fall time ? 20 ns (note 1) 9t hi clock high time 25 50 250 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 10 t lo clock low time 25 50 250 ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 11 t cld clock delay time 50 ? ns 12 t cle clock enable time 50 ? ns 13 t v output valid from clock low ? ? ? 25 50 250 ns ns ns 4.5 v cc 5.5 2.8 v cc < 4.5 1.8 v cc < 2.5 14 t ho output hold time 0 ? ns (note 1) 15 t dis output disable time ? ? ? 25 50 250 ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 (note 1) 16 t hs hold setup time 10 20 100 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 17 t hh hold hold time 10 20 100 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 note 1: this parameter is periodically sampled and not 100% tested. 2: this parameter is not tested but established by characterization and qualification. for endurance estimates in a specific application, please consult the total endurance? model which can be obtained from our web site at www.microchip.com. 3: includes t hi time.
25aa512/25lc512 ds22021b-page 4 preliminary ? 2007 microchip technology inc. table 1-3: ac test conditions 18 t hz hold low to output high-z 15 30 150 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 (note 1) 19 t hv hold high to output valid 15 30 150 ? ? ? ns ns ns 4.5 v cc 5.5 2.5 v cc < 4.5 1.8 v cc < 2.5 20 t rel cs high to standby mode ? 100 sv cc = 1.8v to 5.5v 21 t pd cs high to deep power- down ?100 sv cc = 1.8v to 5.5v 22 t ce chip erase cycle time ? 10 ms v cc = 1.8v to 5.5v 23 t se sector erase cycle time ? 10 ms v cc = 1.8v to 5.5v 24 t wc internal write cycle time ? 5 ms byte or page mode and page erase 25 ? endurance 1m ? e/w cycles (note 2) per page table 1-2: ac characteristics (continued) ac characteristics industrial (i): t a = 0c to +85c v cc = 1.8v to 5.5v industrial (i): t a = -40c to +85c v cc = 2.0v to 5.5v automotive (e): t a = -40c to +125c v cc = 2.5v to 5.5v param. no. sym. characteristic min. max. units conditions note 1: this parameter is periodically sampled and not 100% tested. 2: this parameter is not tested but established by characterization and qualification. for endurance estimates in a specific application, please consult the total endurance? model which can be obtained from our web site at www.microchip.com. 3: includes t hi time. ac waveform: v lo = 0.2v ? v hi = v cc - 0.2v (note 1) v hi = 4.0v (note 2) c l = 30 pf ? timing measurement reference level input 0.5 v cc output 0.5 v cc note 1: for v cc 4.0v 2: for v cc > 4.0v
? 2007 microchip technology inc. preliminary ds22021b-page 5 25aa512/25lc512 figure 1-1: hold timing figure 1-2: serial input timing figure 1-3: serial output timing cs sck so si hold 17 16 16 17 19 18 don?t care 5 high-impedance n + 1 n n - 1 n nn - 1 17 16 17 16 19 18 high-impedance n - 2 n + 1 n n - 2 don?t care cs sck si so 6 5 8 7 11 3 lsb in msb in high-impedance 12 mode 1,1 mode 0,0 2 4 cs sck so 10 9 13 msb out lsb out 3 15 don?t care si mode 1,1 mode 0,0 14
25aa512/25lc512 ds22021b-page 6 preliminary ? 2007 microchip technology inc. 2.0 functional description 2.1 principles of operation the 25xx512 is a 65,536 byte serial eeprom designed to interface directly with the serial periph- eral interface (spi) port of many of today?s popular microcontroller families, including microchip?s pic ? microcontrollers. it may also interface with microcon- trollers that do not have a built-in spi port by using discrete i/o lines programmed properly in firmware to match the spi protocol. the 25xx512 contains an 8-bit instruction register. the device is accessed via the si pin, with data being clocked in on the rising edge of sck. the cs pin must be low and the hold pin must be high for the entire operation. table 2-1 contains a list of the possible instruction bytes and format for device operation. all instructions, addresses, and data are transferred msb first, lsb last. data (si) is sampled on the first rising edge of sck after cs goes low. if the clock line is shared with other peripheral devices on the spi bus, the user can assert the hold input and place the 25xx512 in ?hold? mode. after releasing the hold pin, operation will resume from the point when the hold was asserted. block diagram table 2-1: instruction set si so sck cs hold wp status register i/o control memory control logic x dec hv generator eeprom array page latches y decoder sense amp. r/w control logic v cc v ss instruction name instruction format description read 0000 0011 read data from memory array beginning at selected address write 0000 0010 write data to memory array beginning at selected address wren 0000 0110 set the write enable latch (enable write operations) wrdi 0000 0100 reset the write enable latch (disable write operations) rdsr 0000 0101 read status register wrsr 0000 0001 write status register pe 0100 0010 page erase ? erase one page in memory array se 1101 1000 sector erase ? erase one sector in memory array ce 1100 0111 chip erase ? erase all sectors in memory array rdid 1010 1011 release from deep power-down and read electronic signature dpd 1011 1001 deep power-down mode
? 2007 microchip technology inc. preliminary ds22021b-page 7 25aa512/25lc512 read sequence the device is selected by pulling cs low. the 8-bit read instruction is transmitted to the 25xx512 fol- lowed by the 16-bit address. after the correct read instruction and address are sent, the data stored in the memory at the selected address is shifted out on the so pin. the data stored in the memory at the next address can be read sequentially by continuing to provide clock pulses. the internal address pointer is automatically incremented to the next higher address after each byte of data is shifted out. when the highest address is reached (ffffh), the address counter rolls over to address 0000h allowing the read cycle to be continued indefinitely. the read instruction is terminated by raising the cs pin (figure 2-1). figure 2-1: read sequence so si sck cs 0 234567891011 21222324252627282930 31 1 01 0 0 0 0 01 15 14 13 12 210 76543210 instruction 16-bit address data out high-impedance
25aa512/25lc512 ds22021b-page 8 preliminary ? 2007 microchip technology inc. 2.2 write sequence prior to any attempt to write data to the 25xx512, the write enable latch must be set by issuing the wren instruction (figure 2-4). this is done by setting cs low and then clocking out the proper instruction into the 25xx512. after all eight bits of the instruction are trans- mitted, the cs must be brought high to set the write enable latch. if the write operation is initiated immedi- ately after the wren instruction without cs being brought high, the data will not be written to the array because the write enable latch will not have been properly set. a write sequence includes an automatic, self timed erase cycle. it is not required to erase any portion of the memory prior to issuing a write instruction. once the write enable latch is set, the user may proceed by setting the cs low, issuing a write instruc- tion, followed by the 16-bit address, and then the data to be written. up to 128 bytes of data can be sent to the device before a write cycle is necessary. the only restriction is that all of the bytes must reside in the same page. when doing a write of less than 128 bytes the data in the rest of the page is refreshed along with the data bytes being written. this will force the entire page to endure a write cycle, for this reason endurance is specified per page . for the data to be actually written to the array, the cs must be brought high after the least significant bit (d0) of the n th data byte has been clocked in. if cs is brought high at any other time, the write operation will not be completed. refer to figure 2-2 and figure 2-3 for more detailed illustrations on the byte write sequence and the page write sequence, respectively. while the write is in progress, the status register may be read to check the status of the wpen, wip, wel, bp1 and bp0 bits (figure 2-6). a read attempt of a memory array location will not be possible during a write cycle. when the write cycle is completed, the write enable latch is reset. figure 2-2: byte write sequence note: page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. physical page boundaries start at addresses that are integer multiples of the page buffer size (or ?page size?), and end at addresses that are integer multiples of page size ? 1. if a page write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page as might be expected. it is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. so si cs 9 1011 21222324252627282930 31 00 0 0 0 0 01 15 14 13 12 210 76543210 instruction 16-bit address data byte high-impedance sck 0 234567 18 twc
? 2007 microchip technology inc. preliminary ds22021b-page 9 25aa512/25lc512 figure 2-3: page write sequence si cs 9 1011 21222324252627282930 31 00 0 0 0 0 01 15 14 13 12 210 76543210 instruction 16-bit address data byte 1 sck 0 234567 1 8 si cs 41 42 43 46 47 76543210 data byte n (128 max) sck 32 34 35 36 37 38 39 33 40 76543210 data byte 3 76543210 data byte 2 44 45
25aa512/25lc512 ds22021b-page 10 preliminary ? 2007 microchip technology inc. 2.3 write enable ( wren ) and write disable ( wrdi ) the 25xx512 contains a write enable latch. see table 2-4 for the write-protect functionality matrix. this latch must be set before any write operation will be completed internally. the wren instruction will set the latch, and the wrdi will reset the latch. the following is a list of conditions under which the write enable latch will be reset: ? power-up ? wrdi instruction successfully executed ? wrsr instruction successfully executed ? write instruction successfully executed ? pe instruction successfully executed ? se instruction successfully executed ? ce instruction successfully executed figure 2-4: write enable sequence ( wren ) figure 2-5: write disable sequence ( wrdi ) sck 0 234567 1 si high-impedance so cs 01 0000 0 1 sck 0 234567 1 si high-impedance so cs 01 0000 0 1 0
? 2007 microchip technology inc. preliminary ds22021b-page 11 25aa512/25lc512 2.4 read status register instruction ( rdsr ) the read status register instruction ( rdsr ) provides access to the status register. the status register may be read at any time, even during a write cycle. the status register is formatted as follows: table 2-2: status register the write-in-process (wip) bit indicates whether the 25xx512 is busy with a write operation. when set to a ? 1 ?, a write is in progress, when set to a ? 0 ?, no write is in progress. this bit is read-only. the write enable latch (wel) bit indicates the status of the write enable latch and is read-only. when set to a ? 1 ?, the latch allows writes to the array, when set to a ? 0 ?, the latch prohibits writes to the array. the state of this bit can always be updated via the wren or wrdi commands regardless of the state of write protection on the status register. these commands are shown in figure 2-4 and figure 2-5. the block protection (bp0 and bp1) bits indicate which blocks are currently write-protected. these bits are set by the user issuing the wrsr instruction. these bits are nonvolatile, and are shown in table 2-3. see figure 2-6 for the rdsr timing sequence. figure 2-6: read status register timing sequence ( rdsr ) 7 654 3 2 1 0 w/r ???w/rw/r r r wpen x x x bp1 bp0 wel wip w/r = writable/readable. r = read-only. so si cs 91011 12131415 11 0 0 0 0 00 7654 2 10 instruction data from status register high-impedance sck 0 234567 1 8 3
25aa512/25lc512 ds22021b-page 12 preliminary ? 2007 microchip technology inc. 2.5 write status register instruction ( wrsr ) the write status register instruction ( wrsr ) allows the user to write to the nonvolatile bits in the status register as shown in table 2-2. the user is able to select one of four levels of protection for the array by writing to the appropriate bits in the status register. the array is divided up into four segments. the user has the ability to write-protect none, one, two or all four of the segments of the array. the partitioning is controlled as shown in table 2-3. the write-protect enable (wpen) bit is a nonvolatile bit that is available as an enable bit for the wp pin. the write-protect (wp ) pin and the write-protect enable (wpen) bit in the status register control the programmable hardware write-protect feature. hard- ware write protection is enabled when wp pin is low and the wpen bit is high. hardware write protection is disabled when either the wp pin is high or the wpen bit is low. when the chip is hardware write-protected, only writes to nonvolatile bits in the status register are disabled. see table 2-4 for a matrix of functionality on the wpen bit. see figure 2-7 for the wrsr timing sequence. table 2-3: array protection figure 2-7: write status register timing sequence ( wrsr ) bp1 bp0 array addresses write-protected array addresses unprotected 00 none all (sectors 0, 1, 2 & 3) (0000h-ffffh) 01 upper 1/4 (sector 3) (c000h-ffffh) lower 3/4 (sectors 0, 1 & 2) (0000h-bfffh) 10 upper 1/2 (sectors 2 & 3) (8000h-ffffh) lower 1/2 (sectors 0 & 1) (0000h-7fffh) 11 all (sectors 0, 1, 2 & 3) (0000h-ffffh) none so si cs 91011 12131415 01 0 0 0 0 00 7654 210 instruction data to status register high-impedance sck 0 234567 1 8 3
? 2007 microchip technology inc. preliminary ds22021b-page 13 25aa512/25lc512 2.6 data protection the following protection has been implemented to prevent inadvertent writes to the array: ? the write enable latch is reset on power-up ? a write enable instruction must be issued to set the write enable latch ? after a byte write, page write or status register write, the write enable latch is reset ?cs must be set high after the proper number of clock cycles to start an internal write cycle ? access to the array during an internal write cycle is ignored and programming is continued 2.7 power-on state the 25xx512 powers on in the following state: ? the device is in low-power standby mode (cs =1) ? the write enable latch is reset ? so is in high-impedance state ? a high-to-low-level transition on cs is required to enter active state table 2-4: write-protec t functionality matrix wel (sr bit 1) wpen (sr bit 7) wp (pin 3) protected blocks unprotected blocks status register 0xx protected protected protected 10x protected writable writable 1 1 0 (low) protected writable protected 1 1 1 (high) protected writable writable x = don?t care
25aa512/25lc512 ds22021b-page 14 preliminary ? 2007 microchip technology inc. 2.8 page erase the page erase instruction will erase all bits (ffh) inside the given page. a write enable ( wren ) instruc- tion must be given prior to attempting a page erase . this is done by setting cs low and then clocking out the proper instruction into the 25xx512. after all eight bits of the instruction are transmitted, the cs must be brought high to set the write enable latch. the page erase instruction is entered by driving cs low, followed by the instruction code (figure 2-8) and two address bytes. any address inside the page to be erased is a valid address. cs must then be driven high after the last bit of the address or the page erase will not execute. once the cs is driven high the self-timed page erase cycle is started. the wip bit in the status register can be read to determine when the page erase cycle is complete. if a page erase instruction is given to an address that has been protected by the block protect bits (bp0, bp1) then the sequence will be aborted and no erase will occur. figure 2-8: page erase sequence so si sck cs 0 234567891011 212223 1 00 0 0 0 1 01 15 14 13 12 210 instruction 16-bit address high-impedance
? 2007 microchip technology inc. preliminary ds22021b-page 15 25aa512/25lc512 2.9 sector erase the sector erase instruction will erase all bits (ffh) inside the given sector. a write enable ( wren ) instruction must be given prior to attempting a sector erase . this is done by setting cs low and then clock- ing out the proper instruction into the 25xx512. after all eight bits of the instruction are transmitted, the cs must be brought high to set the write enable latch. the sector erase instruction is entered by driving cs low, followed by the instruction code (figure 2-9) and two address bytes. any address inside the sector to be erased is a valid address. cs must then be driven high after the last bit of the address or the sector erase will not execute. once the cs is driven high the self-timed sector erase cycle is started. the wip bit in the status register can be read to determine when the sector erase cycle is complete. if a sector erase instruction is given to an address that has been protected by the block protect bits (bp0, bp1) then the sequence will be aborted and no erase will occur. see table 2-3 for sector addressing. figure 2-9: sector erase sequence so si sck cs 0 234567891011 212223 1 00 1 1 0 1 10 15 14 13 12 210 instruction 16-bit address high-impedance
25aa512/25lc512 ds22021b-page 16 preliminary ? 2007 microchip technology inc. 2.10 chip erase the chip erase instruction will erase all bits (ffh) in the array. a write enable ( wren ) instruction must be given prior to executing a chip erase . this is done by setting cs low and then clocking out the proper instruction into the 25xx512. after all eight bits of the instruction are transmitted, the cs must be brought high to set the write enable latch. the chip erase instruction is entered by driving the cs low, followed by the instruction code (figure 2-10) onto the si line. the cs pin must be driven high after the eighth bit of the instruction code has been given or the chip erase instruction will not be executed. once the cs pin is driven high the self-timed chip erase instruc- tion begins. while the device is executing the chip erase instruction the wip bit in the status register can be read to determine when the chip erase instruction is complete. the chip erase instruction is ignored if either of the block protect bits (bp0, bp1) are not 0, meaning ?, ?, or all of the array is protected. figure 2-10: chip erase sequence sck 0 234567 1 si high-impedance so cs 11 1000 1 1
? 2007 microchip technology inc. preliminary ds22021b-page 17 25aa512/25lc512 2.11 deep power-down mode deep power-down mode of the 25xx512 is its lowest power consumption state. the device will not respond to any of the read or write commands while in deep power-down mode, and therefore it can be used as an additional software write protection feature. the deep power-down mode is entered by driving c s low, followed by the instruction code (figure 2-11) onto the si line, followed by driving cs high. if the cs pin is not driven high after the eighth bit of the instruction code has been given, the device will not execute deep power-down. once the cs line is driven high there is a delay (t dp ) before the current settles to its lowest consumption. all instructions given during deep power-down mode are ignored except the read electronic signature command (rdid). the rdid command will release the device from deep power-down and outputs the electronic signature on the so pin, and then returns the device to standby mode after delay (t rel ) deep power-down mode automatically releases at device power-down. once power is restored to the device it will power-up in the standby mode. figure 2-11: deep power-down sequence sck 0 234567 1 si high-impedance so cs 10 0111 1 0
25aa512/25lc512 ds22021b-page 18 preliminary ? 2007 microchip technology inc. 2.12 release from deep power- down and read electronic signature once the device has entered deep power-down mode all instructions are ignored except the release from deep power-down and read electronic signa- ture command. this command can also be used when the device is not in deep power-down to read the electronic signature out on the so pin unless another command is being executed such as erase, program or write status register. release from deep power-down mode and read electronic signature is entered by driving cs low, followed by the rdid instruction code (figure 2-12) and then a dummy address of 16 bits (a15-a0). after the last bit of the dummy address is clock in, the 8-bit electronic signature is clocked out on the so pin. after the signature has been read out at least once, the sequence can be terminated by driving cs high. the device will then return to standby mode and will wait to be selected so it can be given new instructions. if additional clock cycles are sent after the electronic signature has been read once, it will continue to output the signature on the so line until the sequence is terminated. figure 2-12: release from deep powe r-down and read electronic signature driving cs high after the 8-bit rdid command but before the electronic signature has been transmitted will still ensure the device will be taken out of deep power-down mode. however, there is a delay t rel that occurs before the device returns to standby mode (i ccs ), as shown in figure 2-13. figure 2-13: release from deep powe r-down and read electronic signature so si sck cs 0 234567 1 01 1 0 1 0 11 instruction high-impedance t rel so si sck cs 0 234567891011 21222324252627282930 31 1 01 1 0 1 0 11 15 14 13 12 210 76543210 instruction 16-bit address electronic signature out high-impedance 0 101001 0 manufacturer?s id = 0x29
? 2007 microchip technology inc. preliminary ds22021b-page 19 25aa512/25lc512 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 chip select (cs ) a low level on this pin selects the device. a high level deselects the device and forces it into standby mode. however, a programming cycle which is already initiated or in progress will be completed, regardless of the cs input signal. if cs is brought high during a program cycle, the device will go into standby mode as soon as the programming cycle is complete. when the device is deselected, so goes to the high-impedance state, allowing multiple parts to share the same spi bus. a low-to-high transition on cs after a valid write sequence initiates an internal write cycle. after power- up, a low level on cs is required prior to any sequence being initiated. 3.2 serial output (so) the so pin is used to transfer data out of the 25xx512. during a read cycle, data is shifted out on this pin after the falling edge of the serial clock. 3.3 write-protect (wp ) this pin is used in conjunction with the wpen bit in the status register to prohibit writes to the nonvolatile bits in the status register. when wp is low and wpen is high, writing to the nonvolatile bits in the status register is disabled. all other operations function normally. when wp is high, all functions, including writes to the nonvolatile bits in the status register, operate normally. if the wpen bit is set, wp low during a status register write sequence will disable writing to the status register. if an internal write cycle has already begun, wp going low will have no effect on the write. the wp pin function is blocked when the wpen bit in the status register is low. this allows the user to install the 25xx512 in a system with wp pin grounded and still be able to write to the status register. the wp pin functions will be enabled when the wpen bit is set high. 3.4 serial input (si) the si pin is used to transfer data into the device. it receives instructions, addresses and data. data is latched on the rising edge of the serial clock. 3.5 serial clock (sck) the sck is used to synchronize the communication between a master and the 25xx512. instructions, addresses or data present on the si pin are latched on the rising edge of the clock input, while data on the so pin is updated after the falling edge of the clock input. 3.6 hold (hold ) the hold pin is used to suspend transmission to the 25lc512 while in the middle of a serial sequence with- out having to re-transmit the entire sequence over again. it must be held high any time this function is not being used. once the device is selected and a serial sequence is underway, the hold pin may be pulled low to pause further serial communication without resetting the serial sequence. the hold pin should be brought low while sck is low, otherwise the hold function will not be invoked until the next sck high-to-low transition. the 25lc512 must remain selected during this sequence. the si and sck levels are ?don?t cares? during the time the device is paused and any transitions on these pins will be ignored. to resume serial communication, hold should be brought high while the sck pin is low, other- wise serial communication will not be resumed until the next sck high-to-low transition. the so line will tri-state immediately upon a high-to- low transition of the hold pin, and will begin outputting again immediately upon a subsequent low-to-high transition of the hold pin, independent of the state of sck. name pin number function cs 1 chip select input so 2 serial data output wp 3 write-protect pin v ss 4 ground si 5 serial data input sck 6 serial clock input hold 7 hold input v cc 8 supply voltage
25aa512/25lc512 ds22021b-page 20 preliminary ? 2007 microchip technology inc. 4.0 packaging information 4.1 package marking information t/xxxnnn xxxxxxxx yyww 8-lead pdip 8-lead soic xxxxyyww xxxxxxxt nnn i/p 1l7 25aa512 0728 example: example: sn 0728 25lc512i 1l7 8-lead dfn example : xxxxxxx t/xxxxx yyww 25lc512 i/mf 0728 1l7 nnn legend: xx...x part number or part number code t temperature (i, e) y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code (2 characters for small packages) pb-free jedec designator for matte tin (sn) note : for very small packages with no room for the pb-free jedec designator , the marking will only appear on the outer carton or reel label. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e * standard marking consists of microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). for marking beyond this, certain price adders apply. please check with your microchip sales office. 3 e 3 e 8-lead soij t/xxxxxx xxxxxxxx yywwnnn example: i/sm 25lc512 3 e 3 e 07281l7
? 2007 microchip technology inc. preliminary ds22021b-page 21 25aa512/25lc512 8-lead plastic dual flat, no lead package (mf) ? 6x5 mm body [dfn-s] notes: 1. pin 1 visual index feature may vary, but must be located within the hatched area. 2. package may have one or more exposed tie bars at ends. 3. package is saw singulated. 4. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millimeters dimension limits min nom max number of pins n 8 pitch e 1.27 bsc overall height a 0.80 0.85 1.00 standoff a1 0.00 0.01 0.05 contact thickness a3 0.20 ref overall length d 5.00 bsc overall width e 6.00 bsc exposed pad length d2 3.90 4.00 4.10 exposed pad width e2 2.20 2.30 2.40 contact width b 0.35 0.40 0.48 contact length l 0.50 0.60 0.75 contact-to-exposed pad k 0.20 ? ? note 2 a1 a a 3 note 1 12 e n d exposed pad note 1 2 1 e2 l n e b k bottom view top view d2 microchip technology drawing c04-122 b
25aa512/25lc512 ds22021b-page 22 preliminary ? 2007 microchip technology inc. 8-lead plastic dual in-line (p) ? 300 mil body [pdip] notes: 1. pin 1 visual index feature may vary, but must be located with the hatched area. 2. significant characteristic. 3. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010" per side. 4. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units inches dimension limits min nom max number of pins n 8 pitch e .100 bsc top to seating plane a ? ? .210 molded package thickness a2 .115 .130 .195 base to seating plane a1 .015 ? ? shoulder to shoulder width e .290 .310 .325 molded package width e1 .240 .250 .280 overall length d .348 .365 .400 tip to seating plane l .115 .130 .150 lead thickness c .008 .010 .015 upper lead width b1 .040 .060 .070 lower lead width b .014 .018 .022 overall row spacing eb ? ? .430 n e1 note 1 d 12 3 a a1 a2 l b1 b e e e b c microchip technology drawing c04-018 b
? 2007 microchip technology inc. preliminary ds22021b-page 23 25aa512/25lc512 8-lead plastic small outline (sn) ? narrow, 3.90 mm body [soic] notes: 1. pin 1 visual index feature may vary, but must be located within the hatched area. 2. significant characteristic. 3. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15 mm per side. 4. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millimeters dimension limits min nom max number of pins n 8 pitch e 1.27 bsc overall height a ? ? 1.75 molded package thickness a2 1.25 ? ? standoff a1 0.10 ? 0.25 overall width e 6.00 bsc molded package width e1 3.90 bsc overall length d 4.90 bsc chamfer (optional) h 0.25 ? 0.50 foot length l 0.40 ? 1.27 footprint l1 1.04 ref foot angle 0 ? 8 lead thickness c 0.17 ? 0.25 lead width b 0.31 ? 0.51 mold draft angle top 5 ? 15 mold draft angle bottom 5 ? 15 d n e e e1 note 1 12 3 b a a1 a2 l l1 c h h microchip technology drawing c04-057 b
25aa512/25lc512 ds22021b-page 24 preliminary ? 2007 microchip technology inc. 8-lead plastic small outline (sm) ? medium, 5.28 mm body [soij] notes: 1. soij, jeita/eiaj standard, formerly called soic. 2. significant characteristic. 3. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.25 mm per side. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millimeters dimension limits min nom max number of pins n 8 pitch e 1.27 bsc overall height a 1.77 ? 2.03 molded package thickness a2 1.75 ? 1.98 standoff a1 0.05 ? 0.25 overall width e 7.62 ? 8.26 molded package width e1 5.11 ? 5.38 overall length d 5.13 ? 5.33 foot length l 0.51 ? 0.76 foot angle 0 ? 8 lead thickness c 0.15 ? 0.25 lead width b 0.36 ? 0.51 mold draft angle top ? ? 15 mold draft angle bottom ? ? 15 l c a2 a1 a b 12 e e e1 n d microchip technology drawing c04-056b
? 2007 microchip technology inc. preliminary ds22021b-page 25 25aa512/25lc512 appendix a: revision history revision a original release. revision b (06/2007) revised device selection table; revised features section; revised table 1-1 dc characteristics; revised table 1-2 ac characteristics; replaced pack- age drawings (rev. ap); revised package marking (soic, soij); revised product id section.
25aa512/25lc512 ds22021b-page 26 preliminary ? 2007 microchip technology inc. notes:
? 2007 microchip technology inc. preliminary ds22021b-page 27 25aa512/25lc512 the microchip web site microchip provides online support via our www site at www.microchip.com. this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com, click on customer change notification and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support ? development systems information line customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://support.microchip.com
25aa512/25lc512 ds22021b-page 28 preliminary ? 2007 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip prod- uct. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this document. to : technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds22021b 25aa512/25lc512 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you think would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document?
? 2007 microchip technology inc. preliminary ds22021b-page 29 25aa512/25lc512 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . part no. x /xx package tape & reel device device: 25aa512 25lc512 512 kbit, 1.8v, 128-byte page spi serial eeprom 512 kbit, 2.5v, 128-byte page spi serial eeprom tape & reel: blank = t= standard packaging (tube) ta p e & r e e l temperature range: i= e= -40 c to+85 c -40 c to+125 c package: mf = p= sn = micro lead frame (6 x 5 mm body), 8-lead plastic dip (300 mil body), 8-lead plastic soic (3.90 mm body), 8-lead examples: a) 25aa512-i/sn = 512 kbit, 1.8v serial eeprom, industrial temp., soic package b) 25aa512t-i/sm = 512 kbit, 1.8v serial eeprom, industrial temp., tape & reel, soij package c) 25aa512t-i/mf = 512 kbit, 1.8v serial eeprom, industrial temp., tape & reel, dfn package d) 25lc512-i/sm = 512 kbit, 2.5v serial eeprom, industrial temp., soij package e) 25lc512-i/p = 512 kbit, 2.5v serial eeprom, industrial temp., p-dip package f) 25lc512t-e/mf = 512 kbit, 2.5v serial eeprom, extended temp., tape & reel, dfn package ? x tem p range
25aa512/25lc512 ds22021b-page 30 preliminary ? 2007 microchip technology inc. notes:
? 2007 microchip technology inc. preliminary ds22021b-page 31 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , k ee l oq logo, micro id , mplab, pic, picmicro, picstart, pro mate, rfpic and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, linear active thermistor, migratable memory, mxdev, mxlab, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip tec hnology incorporated in the u.s.a. analog-for-the-digital age, appl ication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, real ice, rflab, select mode, smart serial, smarttel, total endurance, uni/o, wiperlock and zena are tr ademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2007, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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